Mitsubishi Electric Begins Supplying Power Semiconductor Chips Made from 12-inch Wafers for Semiconductor Module Assembly
Mitsubishi Electric Begins Supplying Power Semiconductor Chips Made from 12-inch Wafers for Semiconductor Module Assembly
Castel Focuses on CO2 Refrigerant as a Future Promising Solution
Hailin Control Technology — A ‘Little Giant’ in the Controller Industry
Digital and sustainable future: CAREL's offering at Chillventa 2024
The new BPHE S65 model for heat pumps was presented at the Chillventa Specialist Forum
Discover Multi-Wing's innovative fan solutions at Interclima.
Danfoss: Introducing the Next-Generation AME 110NL(X) Modulating Actuators
Primetals Technologies to Provide Continuous Caster Maintenance for Outokumpu Stainless USA
Multi-Wing: “We’re setting the new standard” with the C Series...
CAREL Heos Pro Offers Efficient Solution for RDC
AI-Driven Data Centres: Daikin at Datacloud 2026
2026.04.24
Carrier Launches Inverter Modular Water-Cooled Chillers and Heat Recovery Chillers in Japan
2026.04.25
Danfoss: new Optyma™ iCO₂ 37kW MT/20kW LT: Next-generation efficiency and reliability for CO₂ refrigeration
2026.04.26
Introducing Xinlei’s R290 EVI ATW Heat Pump （8-16KW）– A New Benchmark for Europe’s Carbon-Neutral Heating
PR | 2026.05.01
Mitsubishi Electric marks ten years in the Applied HVAC business
2026.04.24
